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This section includes the various tables for microcircuits, gate arrays, logic arrays and microprocessors.

Microcircuit failure rate, C₁

Microcircuit Type	C₁
Bipolar, Digital, 1 to 100 gates	0.0025
Bipolar, Digital, 101 to 1,000 gates	0.0050
Bipolar, Digital, 1,001 to 3,000 gates	0.0100
Bipolar, Digital, 3,001 to 10,000 gates	0.0200
Bipolar, Digital, 10,001 to 30,000 gates	0.0400
Bipolar, Digital, 30,001 to 60,000	0.0800
Bipolar, Linear, 1 to 100 transistors	0.0100
Bipolar, Linear, 101 to 300 transistors	0.0200
Bipolar, Linear, 301 to 1,000 transistors	0.0400
Bipolar, Linear, 1,001 to 10,000 transistors	0.0600
Bipolar PLA/PAL, up to 200 gates	0.0100
Bipolar PLA/PAL, 201 to 1,000 gates	0.0210
Bipolar PLA/PAL, 1,001 to 5,000 gates	0.0420
MOS Digital, 1 to 100 gates	0.0100
MOS, Digital, 101 to 1,000 gates	0.0200
MOS, Digital, 1,001 to 3,000 gates	0.0400
MOS, Digital, 3,001 to 10,000 gates	0.0800
MOS, Digital, 10,001 to 30,000 gates	0.1600
MOS, Digital, 30,001 to 60,000	0.2900
MOS, Linear, 1 to 100 transistors	0.0100
MOS, Linear, 101 to 300 transistors	0.0200
MOS, Linear, 301 to 1,000 transistors	0.0400
MOS, Linear, 1,001 to 10,000 transistors	0.0600
MOS PLA/PAL, up to 500 gates	0.0008
MOS PLA/PAL, 201 to 1,000 gates	0.0017
MOS PLA/PAL, 1,001 to 5,000 gates	0.0034
MOS PLA/PAL, 1,001 to 5,000 gates	0.0068
Bipolar Microprocessor, Up to 8 bits	0.0600
Bipolar Microprocessor, Up to 16 bits	0.1200
Bipolar Microprocessor, Up to 32 bits	0.2400
MOS Microprocessor, Up to 8 bits	0.1400
MOS Microprocessor, Up to 16 bits	0.2800
MOS Microprocessor, Up to 32 bits	0.5600

Temperature Factor - π_T

	TTL, ASTTL, CML, HTTL, FTTL, DTL, ECL, ALSTTL	F, LTTL, STTL	BICMOS, LSTTL	III, I³L, ISL	Digital MOS, VHSIC CMOS	Linear (Bipolar & MOS)	Memories (Bipolar & MOS), MNOS
Ea(eV)→T_J(Â°C)	0.4	0.45	0.5	0.6	0.35	0.65	0.6
25	0.100	0.100	0.100	0.100	0.100	0.100	0.100
30	0.129	0.134	0.138	0.147	0.125	0.152	0.147
35	0.166	0.177	0.188	0.214	0.156	0.227	0.214
40	0.211	0.232	0.254	0.306	0.192	0.336	0.306
45	0.266	0.301	0.340	0.435	0.236	0.491	0.435
50	0.334	0.388	0.451	0.610	0.287	0.709	0.610
55	0.416	0.497	0.594	0.847	0.348	1.013	0.847
60	0.514	0.631	0.774	1.166	0.419	1.430	1.166
65	0.632	0.796	1.002	1.588	0.502	2.000	1.588
70	0.772	0.997	1.287	2.144	0.598	2.769	2.144
75	0.938	1.240	1.641	2.871	0.709	3.797	2.871
80	1.133	1.534	2.078	3.811	0.836	5.162	3.811
85	1.361	1.886	2.614	5.020	0.982	6.957	5.020
90	1.627	2.306	3.268	6.562	1.148	9.300	6.562
95	1.936	2.803	4.060	8.516	1.337	12.334	8.516
100	2.292	3.391	5.016	10.975	1.550	16.234	10.975
105	2.702	4.081	6.162	14.049	1.790	21.213	14.049
110	3.172	4.887	7.529	17.868	2.059	27.526	17.868
115	3.709	5.826	9.152	22.585	2.361	35.479	22.585
120	4.318	6.914	11.070	28.378	2.697	45.436	28.378
125	5.009	8.170	13.326	35.453	3.071	57.825	35.453
130	5.789	9.615	15.968	44.047	3.486	73.154	44.047
135	6.667	11.269	19.050	54.434	3.944	92.016	54.434
140	7.651	13.158	22.629	66.927	4.449	115.098	66.927
145	8.752	15.307	26.770	81.881	5.004	143.203	81.881
150	9.980	17.743	31.544	99.701	5.614	177.252	99.701
155	11.345	20.496	37.026	120.841	6.280	218.306	120.841
160	12.859	23.597	43.301	145.814	7.007	267.578	145.814
165	14.533	27.080	50.459	175.196	7.799	326.451	175.196
170	16.379	30.980	58.597	209.627	8.660	396.493	209.627
175	18.411	35.337	67.820	249.823	9.593	479.478	249.823

Number of Functional Pins, N_P	Hermetic: DIPs w/Solder or Weld Seal, PGA, SMT	DIPs w/Glass Seal, PGA, SMT	Flatpacks with Axial Leads on 50 mil Centers	Cans	Nonhermetic DIPs, PGA, SMT
3	0.000917	0.000473	0.000222	0.000273	0.001179
4	0.001251	0.000730	0.000374	0.000487	0.001609
6	0.001939	0.001347	0.000782	0.001100	0.002493
8	0.002645	0.002079	0.001321	0.001960	0.003401
10	0.003366	0.002912	0.001982	0.003070	0.004328
12	0.004099	0.003835	0.002762	0.004429	0.005270
14	0.004841	0.004841	0.003657	0.006037	0.006225
16	0.005593	0.005922	0.004663	0.007896	0.007190
18	0.006351	0.007075	0.005777	0.010005	0.008166
22	0.007888	0.009579	0.008324	0.014976	0.010142
24	0.008665	0.010923	0.009752	0.017838	0.011141
28	0.010235	0.013786	0.012911	0.024317	0.013159
36	0.013427	0.020149	0.020398	0.040299	0.017263
40	0.015045	0.023624	0.024710	0.049804	0.019343
64	0.024994	0.048037	0.058126	0.128098	0.032135
80	0.031805	0.067283	0.087246	0.200601	0.040892
128	0.052838	0.136814	0.205231	0.515957	0.067934
180	0.076358	0.228931	0.381696	1.023809	0.098174
224	0.096700	0.318506	0.568293	1.588985	0.124328

Quality Factor	Description	π_Q
Class S Categories	1. Procured in full accordance with MIL-M-38510, Class S requirements. 2. Procured in full accordance with MIL-I-38535 and Appendix B thereto (class U). 3. Hybrids: (Procured to Class S requirements (Quality Level K) of MIL-H-38534.	0.2
Class B Categories	1. Procured in full accordance with MIL-M-38510, Class B requirements. 2. Procured in full accordance with MIL-I-38535 (class Q). 3. Hybrids: (Procured to Class B requirements (Quality Level H) of MIL-H-38534.	1.0
Class B-1 Categories	Fully compliant with all requirements of paragraph 1.2.1 of MIL-STD-883 and procured to a MIL drawing, DESC drawing or other government approved documentation. (Does not include hybrids). For hybrids use custom screening section below.	2.0
Commercial or unknown screening levels		10.0
Custom screening	See below	0.0

Group	MIL-STD-883 Screen/Test (Note 3)	Point Valuation
1*	TM 101O (Temperature Cycle, Condition B Minimum)and TM 2001 (Constant Acceleration, Condition B Minimum) and TM 5004 (or 5008 for Hybrids) (Final Electricals @ Temperature Extremes) and TM 1014 (Seal Test, Condition A, B, or C) and TM 2009 (External Visual)	50.0
2*	TM 101O (Temperature Cycle, Condition B Minimum)and TM 2001 (Constant Acceleration, Condition B Minimum) TM 5004 (or 5008 for Hybrids) (Final Electricals @ Temperature Extremes) and TM 1014 (Seal Test, Condition A, B, or C) and TM 2009 (External Visual)	37.0
3 (B Level)	Pre-Burn in Electricals TM 1015 (Burn-in B-Level) and TM 5004 (or 5008 for Hybrids) (Post Burn-in Electricals @ Temperature Extremes)	30.0
3 (S Level)	Pre-Burn in Electricals TM 1015 (Burn-in B-Level) and TM 5004 (or 5008 for Hybrids) (Post Burn-in Electricals @ Temperature Extremes)	36.0
4*	TM 2020 Pind (Particle Impact Noise Detection)	11.0
5 (note 1)	TM 5004 (or 5008 for Hybrids) (Final Electricals @ Temperature Extremes)	11.0
6	TM 2010/17 (Internal Visual)	7.0
7* (note 2)	TM 1014 (Seal Test, Condition A, B or C)	7.0
8	TM 2012 (Radiography)	7.0
9 (note 2)	TM 2009 (External Visual)	7.0
10	TM 5007/5013 (GaAs) (Water Acceptance)	1.0
11	TM 2023 (Non-Destructive Bond Pull)	1.0

* Not appropriate for plastic parts

Notes:

Point valuation only assigned if used independent of Groups 1, 2 or 3.
Point valuatbn only assigned if used independent of Groups 1 or 2.
Sequencing of tests within groups 1, 2 and 3 must be followed.
TM refers to the MIL-STD-883 Test Method.
Nonhermetic parts should be used only in controlled environments (i.e., G_B and other temperature/humidity controlled environments).